Semiconductors
Chips, memory, packaging, EDA tools and foundry equipment enabling AI computation.
Active institutional funds cut a net $10.9 billion in Q2 2026, versus $33.5 billion in Q1 2026 — an outflow 67% smaller. 49.3% of companies in this theme saw decreased active positions in Q2 2026.
Ecosystem Map
Electronic design automation software enabling chip architecture. Vendors of EDA software and simulation tools; excludes semiconductor IP licensors and chip designers that use EDA tools but do not sell them.
Contract chip manufacturing facilities that produce chips designed by external (often fabless) client companies, distinct from companies that operate their own fabs solely to produce their own in-house designed products.
Chiplet integration, CoWoS, HBM stacking and advanced packaging technologies. Die- and wafer-level packaging only; excludes board-level and system-level electronics assembly (EMS).
IGBTs, MOSFETs and SiC/GaN devices for power conversion and EV applications.
Lithography, deposition and inspection tools for chip fabrication.
Silicon wafers, photoresists, gases, chemicals, substrates and CMP materials consumed in chip fabrication. Distinct from Semiconductor Equipment and from Foundries.
Bottleneck Tracker
Bottleneck details are part of the Pro plan.
Recent Discoveries
Recent discoveries are part of the Pro plan.