MU·NasdaqGS·US
Micron
Micron Technology, Inc. provides semiconductor memory and storage products, including DRAM, NAND, and NOR solutions, used in applications ranging from cloud to edge computing. It sells these products through business units into markets such as data center, mobile, client, consumer, automotive, and embedded/industrial segments. Micron positions itself as a global leader in semiconductor memory and storage powering AI and compute-intensive applications.
Source: SEC 10-K Oct 9, 2026
Recent Activity
Updated Oct 31, 2026
–Micron's next NAND node is G11, with no G10 in between.
–It features wafer-on-wafer bonding, more than 400 layers, 2x the bit density of G9, 1.5x I/O and a 2H 2027 ramp, and a 512TB SSD is on the roadmap.
–Micron detailed DDR6 with 2x the bandwidth of DDR5 and LPDDR6 with 35% better power efficiency, both built on its upcoming 1δ DRAM node, which follows 1γ.
–Micron plans to use wafer bonding and High-NA EUV for next-gen DRAM.
–It is also developing vertical high-bandwidth memory and vertical edge inference memory integrated directly on top of processors.
–Micron removed 4F2 memory cells from its DRAM roadmap, after more than 20 years of work on the technology, and will rely on other methods to keep scaling DRAM.
–Micron's Boise campus, recently the site of a $50 billion expansion, will produce 1δ memory.
–Micron announced over $67 million in new Idaho community investments for transportation, housing and children, building on roughly $75 million contributed since 2023.
–Micron reached a labor-management agreement with its Taichung union in Taiwan, while a separate Taoyuan union prepared for an October 22 strike over bonuses.
–Hundreds of workers at a Micron plant in Taiwan rejected the company's proposal for a new profit-sharing system.
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