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Optical Interconnects & Co-Packaged Optics

Optical Interconnects & Co-Packaged Optics is the layer of transceivers, DSPs, lasers, silicon photonics and co-packaged optics that moves data across AI compute clusters, sitting between chip-level interconnect and broader network fabric or long-haul fiber. The competitive set spans optical systems and component leaders (Nokia, Coherent, Ciena, Applied Optoelectronics, Lumentum, Semtech, Marvell) and semiconductor/manufacturing enablers (MaxLinear, MACOM, Broadcom, Nvidia, Astera Labs, Credo Technology, Analog Devices, Fabrinet). Capital and supply commitments from Nvidia into Coherent and Lumentum, together with new Indium Phosphide wafer and fabrication capacity agreements, are currently anchoring the sub-theme's growth narrative.

Active institutional funds cut a net $22.6 billion in Q2 2026, versus $13.8 billion in Q1 2026 — an outflow 64% larger. 78.9% of companies in this sub-theme saw decreased active positions in Q2 2026.

Overview

This sub-theme covers the physical layer that carries data between and within AI compute clusters at the component level: optical transceivers, digital signal processors, lasers, silicon photonics engines, and co-packaged/near-packaged optics. It is distinct from AI Networking, which covers fabric switching, and from Fiber & Connectivity, which covers metro, long-haul and subsea fiber infrastructure. The value chain includes optical systems and component leaders such as Nokia, Coherent, Ciena, Applied Optoelectronics, Lumentum, Semtech, Corning and Marvell, alongside semiconductor and manufacturing enablers including MaxLinear, MACOM, Broadcom, Nvidia, Astera Labs, Credo Technology, Analog Devices and contract manufacturer Fabrinet. Coherent supplies lasers and optical networking products to Nvidia, and Lumentum maintains a supplier relationship with Nvidia spanning optical and photonic products; Nvidia holds equity stakes in both companies. Applied Optoelectronics and Fabrinet count hyperscale customers including Amazon, Microsoft, Cisco and Nvidia among their largest revenue sources. Component manufacturing in this space depends on specialized materials such as Indium Phosphide wafers, supplied in part by AXT, and on contract manufacturing and packaging partners such as Fabrinet, Celestica and Amkor Technology.

Investment Thesis

Growth Drivers
Risks
What Could Change This

Investment thesis details are part of the Pro plan.

Bottleneck Tracker

2026
Current
2026
Current
2027
Next
2028

Bottleneck details are part of the Pro plan.

Key Companies

Related Events

SectorMarvell to acquire Lumentum for $115BNov 3, 2026

Marvell is buying Lumentum in a $115B all-stock deal to become a one-stop shop for AI photonics. The deal fills gaps in lasers, transceivers, optical circuit switches and indium phosphide fabrication. It follows Marvell's roughly $3.5B Celestial AI purchase in February 2026 and Nvidia's $2B investment in Lumentum eight months ago. Copper reach falls as per-lane speeds pass 400 Gbps, which pushes AI rack-scale builders toward optics. Marvell's market cap is about $180B, so the stock-funded deal is large relative to the company, and it does not close until the first half of 2028.

SectorNvidia funds substrate, packaging, optics capacity expansionOct 22, 2026

Nvidia is using its cash pile to secure scarce back-end capacity, with CEO Jensen Huang saying "Capacity is the constraint." Substrate makers Samsung Electro-Mechanics, IBIDEN and Unimicron gain anchor demand and expansion funding, while Amkor and SPIL gain volume visibility in packaging and optics. The commitments signal Nvidia expects the AI infrastructure boom to run for years and help reassure investors on supply. Locking in capacity may squeeze rival AI chip designers competing for the same substrate and packaging resources. The risk is overbuild if AI demand cools, leaving suppliers with stranded capacity.

TechnologyCisco, Nvidia unveil 12.8 Tbps USFP opticOct 15, 2026

A pluggable optic at 12.8 Tbps would sharply raise bandwidth density for AI cluster cabling, favoring optical module, DSP and laser suppliers who can meet 400G-per-lane and 100 W thermal demands. Nvidia's participation, despite its move to co-packaged optics on its switches, shows pluggables remain strategic for NICs and flexible deployments. The open standard widens the addressable market beyond Cisco and Nvidia but raises thermal, reliability and blast-radius challenges for module and cage makers. Microsoft's use of Cisco's P200 for scale-across networking strengthens Cisco's position against Nvidia Spectrum-XGS and Broadcom Jericho 4. Commercial impact is gradual, tied to 204.8 Tbps switches and Vera Rubin Ultra-class racks later in the decade.

SectorGlobalFoundries Gets $300M US Silicon Photonics GrantJul 29, 2026

Silicon photonics is increasingly critical for AI data center optical interconnects and defense sensing, and this grant structurally positions GlobalFoundries as a state-backed competitor in that supply chain. The government equity stake signals a durable policy commitment rather than a one-time subsidy, shifting the competitive landscape for optical component suppliers. Incumbent silicon photonics players and pure-play optical interconnect firms face a better-funded rival with sovereign backing. Data center hyperscalers seeking domestic photonics supply chains gain a more credible US-sourced option. Intel, which is also involved in defense chip programs (RAMP-C wrap-up noted in the same article), remains a reference point but GlobalFoundries now has a dedicated photonics mandate.

SectorVerizon Signs $1B Dark Fiber Deal for Google Data CentersJul 27, 2026

This deal signals a structural shift in how hyperscalers procure connectivity: dedicated dark fiber contracts rather than managed bandwidth services, which durably benefits fiber infrastructure owners and disadvantages managed-service-only carriers. Verizon gains a recurring, high-margin revenue stream tied directly to AI infrastructure buildout rather than consumer broadband cyclicality. Other dark fiber providers and long-haul fiber network operators are positioned to win similar hyperscaler contracts as AI campus buildouts accelerate globally. Traditional telecom managed-bandwidth revenue faces substitution pressure as large cloud operators bypass shared networks. Equipment suppliers in fiber splicing, DWDM, and optical networking benefit from the associated capacity upgrades.