Nvidia funds substrate, packaging, optics capacity expansion

At GTC Berlin, Nvidia announced it will raise substrate capacity 2.5x over three years, adding Samsung Electro-Mechanics as a supplier and expanding IBIDEN and Unimicron. It also signed an Amkor packaging capacity reservation (+300%) and expanded its SPIL optics deal (15x by mid-2027).

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Nvidia is using its cash pile to secure scarce back-end capacity, with CEO Jensen Huang saying "Capacity is the constraint." Substrate makers Samsung Electro-Mechanics, IBIDEN and Unimicron gain anchor demand and expansion funding, while Amkor and SPIL gain volume visibility in packaging and optics. The commitments signal Nvidia expects the AI infrastructure boom to run for years and help reassure investors on supply. Locking in capacity may squeeze rival AI chip designers competing for the same substrate and packaging resources. The risk is overbuild if AI demand cools, leaving suppliers with stranded capacity.