TSMC Taps GlobalFoundries for US Silicon Interposers

TSMC and GlobalFoundries announced a $2 billion multi-year deal for GloFo to produce silicon interposers for TSMC's CoWoS advanced packaging at its Malta, New York fab, targeting first-half 2028 volume production. The move aims to close a domestic advanced-packaging gap that currently forces AI chips made in US fabs to be shipped to Taiwan for final assembly.

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The deal signals a structural push to localize advanced semiconductor packaging in the US, a step long seen as the weakest link in domestic AI chip manufacturing. GlobalFoundries gains a new high-value revenue stream and strategic relevance in leading-edge packaging alongside TSMC and Intel Foundry. Nvidia, AMD and other HBM-dependent chipmakers stand to benefit from reduced reliance on Taiwan round-trips once capacity comes online in 2028, though near-term bottlenecks persist. The announcement intensifies competitive dynamics among Amkor, Intel Foundry and GlobalFoundries for US CoWoS-compatible packaging business. Investors should view this as a multi-year infrastructure build rather than an immediate capacity relief, given the 2028 timeline.