TSMC, Samsung Commit to ASML High NA EUV

TSMC and Samsung have both formally committed to using ASML's $400 million High NA EUV lithography machines, with Samsung adopting the tool for DRAM in 2028 and TSMC for advanced logic chips in 2030. The commitments, driven by AI-related demand for more complex transistor architectures, join Intel as customers and give ASML greater visibility into future High NA adoption.

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The dual commitment from the world's two largest chipmakers resolves a key investor debate about High NA EUV adoption, removing a major overhang on ASML's long-term growth narrative. Barclays flagged the news as a clear positive that gives ASML better planning visibility and raises the prospect of further EUV capacity expansion beyond current 2027 targets. For TSMC and Samsung, the multi-year roadmap (2028 for DRAM, 2030 for logic) signals continued massive capex commitments tied directly to AI-driven demand for smaller, more complex transistor geometries. The parallel 12-inch photomask initiative also signals broader supply-chain modernization that could benefit adjacent packaging and materials suppliers. Overall, the event reinforces ASML's position as an indispensable AI-cycle bottleneck supplier while extending the leading-edge capex super-cycle among foundries and memory makers.